Bump Plating Systems

AmeriChem Engineering Services has been developing ever more advanced bump plating systems for more than 20 years. We have earned a reputation for excellence for both our rack and perimeter flow (cup) bump plating systems. Over fifty AmeriChem bump platers have been shipped around the world. These have been for such processes as, gold, silver, nickel, copper, tin, and tin-lead plating.

The experience gained in producing and supporting bump plating units has lead to the evolution of equipment that produces uniformly distributed bumps with the utmost precision.

Producing perfect bumps requires the best equipment. AmeriChem manufactures three different types of premium quality bump plating units:

Perimeter Flow (cup)
Rack Plating
Combination Rack Plating/Perimeter Flow

The heart of any bump plating system is the rectifier. AmeriChem offers a large selection of options. These include:

Pulsed DC Rectification (forward/reverse)
Straight DC Rectification (less than 0.1% ripple)
You can have an AmeriChem bump plating system custom made to your specifications; or you can select from a wide range of pre-engineered systems.

Request a quote for bump plating equipment today!

Bump plating systems

AmeriChem Engineering Services
3430 East Broadway Rd.
Phoenix, Arizona 85040
Toll-Free! 1-888-437-1187
Tel: 602-437-1188
Fax: 602-437-4860

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