AmeriChem Engineering
Services has been developing ever more advanced bump plating systems
for more than 20 years. We have earned a reputation for excellence
for both our rack and perimeter flow (cup) systems. Over fifty AmeriChem
bump platers have been shipped around the world. These have been
for such processes as, gold, silver, nickel, copper, tin, and tin-lead
plating.
The experience gained in producing and supporting
these units has lead to the evolution of equipment that produces
uniformly distributed bumps with the utmost precision.
Producing perfect bumps requires the best equipment.
AmeriChem manufactures three different types of premium quality
bump plating units:
- Perimeter Flow (cup)
- Rack Plating
- Combination Rack Plating/Perimeter
Flow
The heart of any bump plating system is the rectifier.
AmeriChem offers a large selection of options. These include:
- Pulsed DC Rectification (forward/reverse)
- Straight DC Rectification (less than
0.1% ripple)
- You can have an AmeriChem bump plating
system custom made to your specifications; or you can select from
a wide range of pre-engineered systems.
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AmeriChem Engineering
Services
3430 East Broadway Rd.
Phoenix, Arizona 85040
Toll-Free! 1-888-437-1187
Tel: 602-437-1188
Fax: 602-437-4860
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